Organizing Committee:

General Co-Chairs
Lingjia Liu, Virginia Tech, USA
John Smee, Qualcomm, USA
Thomas Rondeau, Department of Defense, USA

Advisory Committee
Robert Calderbank,  Duke University, US
Brian Daly, AT&T, US
Gerhard Fettweis, Dresden University of Technology, Germany
Andrea Goldsmith, Princeton University, US
Javier Gozalvez, Universidad Miguel Hernandez de Elche, Spain

Technical Program Co-Chairs
Mike Buehrer, Virginia Tech, US
Rui Dinis, Universidade Nova de Lisboa, Portugal
Song Guo, Hong Kong University of Science and Technology, China 

Publications Chair
James Irvine, University of Strathclyde, UK

Keynotes & Panels Co-Chairs

Tutorials Chair

Workshops Co-Chairs 
Sumit Roy, University of Washington, USA
Zeng Kai, George Mason University, USA
Ryan Thomas, Johns Hopkins University Applied Physics Laboratory, USA

Patronage & Exhibit Co-Chairs

Publicity Co-Chairs
Chuan Huang, Chinese University of Hong Kong (Shenzhen), China
Bo Ji, Virginia Tech, US
Luca Lusvarghi, Universidad Miguel Hernandez de Elche, Spain

Local Arrangements Chair

Finance Chair 
J. R. Cruz, The University of Oklahoma, USA

Conference Administrators
Rodney C. Keele, The University of Oklahoma, USA
Cerry Leffler, The University of Oklahoma, USA