Organizing Committee:

General Co-Chairs
Lingjia Liu, Virginia Tech, USA
John Smee, Qualcomm, USA
Thomas Rondeau, Department of Defense, USA

Advisory Committee
Robert Calderbank,  Duke University, US
Brian Daly, AT&T, US
Gerhard Fettweis, Dresden University of Technology, Germany
Andrea Goldsmith, Princeton University, US
Javier Gozalvez, Universidad Miguel Hernandez de Elche, Spain

Technical Program Co-Chairs
Mike Buehrer, Virginia Tech, US
Rui Dinis, Universidade Nova de Lisboa, Portugal
Song Guo, Hong Kong University of Science and Technology, China 

Publications Chair
James Irvine, University of Strathclyde, UK

Keynotes Chair
Lajos Hanzo, University of Southampton, UK

Panels Co-Chairs
Alvin Chin, University of Illinois, USA
Wanshi Chen, Qualcomm, USA
Martin Weiss, US DoD and University of Pittsburgh, USA
Jorge Pereira, European Commission

Tutorials Chair

Workshops Co-Chairs 
Sumit Roy, University of Washington, USA
Zeng Kai, George Mason University, USA
Ryan Thomas, Johns Hopkins University Applied Physics Laboratory, USA

Publicity Co-Chairs
Chuan Huang, Chinese University of Hong Kong (Shenzhen), China
Bo Ji, Virginia Tech, US
Luca Lusvarghi, Universidad Miguel Hernandez de Elche, Spain

Local Arrangements Chair
Alkan Soysal, Virginia Tech University, USA
Imtiaz Ahmed, Howard University, USA
Sai Manoj Pudukotai Dinakarrao, George Mason University, USA

 

Finance Chair 
J. R. Cruz, The University of Oklahoma, USA

Conference Administrators
Rodney C. Keele, The University of Oklahoma, USA
Cerry Leffler, The University of Oklahoma, USA