Industry Track Panel Moderator – 5G Baseband Chip Design Issues

Summary—Topics in 5G baseband chip design issues will be discussed, in the form of invited talks and a final panel discussion.

Biography:

Alan Gatherer is a Senior Technical Vice President at Huawei Technologies, USA and Fellow of the IEEE. He is responsible for R&D efforts in the US to develop next generation baseband chips and software for 4G and 5G basestation modems. His group is developing new technologies for baseband SoC in the areas of dynamic multimode modems, interconnect and memory fabric, CPU/DSP clusters and virtualization, focusing on 5G deployment. Alan joined Huawei in January 2010. Prior to that he was a TI Fellow and CTO at Texas Instruments where he led the development of high performance, multicore DSP at TI and worked on various telecommunication standards. Alan has authored multiple journal and conference papers and is regularly asked to give keynote and plenary talks at communication equipment conferences. In addition, he holds over 70 awarded patents and is author of the book “The Application of Programmable DSPs in Mobile Communications.” Alan holds a bachelor of engineering in microprocessor engineering from Strathclyde University in Scotland. He also attended Stanford University where he received a master’s in electrical engineering in 1989 and his doctorate in electrical engineering in 1993.